2012 Events

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The IEEE Ottawa Antennas and Propagation Society and Microwave Theory & Techniques Society (AP/MTT) Joint Chapter, Electron Devices Society, Circuits and Systems Society, and Solid-State Circuits Society (EDS/CAS/SSCS) Joint Chapter, Components, Packaging and Manufacturing Technology (CPMT) Chapter, IEEE Ottawa Section (OS), and Department of Electronics at Carleton University (DoE Carleton) are inviting all interested IEEE members and other engineers, technologists, and students to the IEEE Microwave Theory and Techniques Society (MTT-S) Speakers Bureau Talk.

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The social impact of innovations in electronics is undisputed. From hundreds of megahertz to millimeter-wave frequencies, the evolution of wireless has brought convenience into our day-to-day lives in the form of communication through smart phones, navigation by GPS, information sharing through wireless sensor networks and safety by automotive radars. The next in the line are intelligent wearable sensing and wireless communication devices. The demand for increasingly higher rates of data, voice and video transmission, together with miniaturization of portable and wireless technologies, has driven the need for high-performance solutions that are low cost as well. The focus of this talk is to address miniaturization concepts for power efficient sensing and wireless communication systems in low cost and environmentally friendly ("green") mediums. Concepts such as CMOS system-on-chip (SoC), 3D system-on-package (SoP) in ceramic (LTCC) and organic (LCP) mediums, paper-based inkjet-printed RF electronics will be introduced. Several examples, representative of the concepts introduced above, will be presented.

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Recently, with the aggressive scaling of the semiconductor process, silicon based semiconductor technologies have been progressively expanded into the millimeter-waves (mmW) and Terahertz (THz) applications. Cost-effective silicon based millimeter-wave/Terahertz integrated circuits (IC) design and fabrication are increasingly possible and feasible for many applications in medical, security, and non-destructive testing fields, as well as for military applications, such as, target discrimination, air and space communications. This talk will introduce silicon based device modeling, millimeter wave and Terahertz IC circuits and Tx/Rx system design techniques for terahertz communications and imaging applications, and share latest research results with audience.

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The spectral resource of the golden frequency band up to 6GHz is nearly exhausted and has been occupied by lots of wireless communication systems, such as mobile communication, GPS, RFID, navigation, DVB-T, WLAN etc. Thus, millimeter wave wireless communications for high speed short range access and long range link become very hot. Some standards, such as IEEE 802.11ad, 802.15.3c etc. have been released. 60GHz is chosen for these standards. From technical point of view, 60GHz is not a good choice for high data rate and high quality wireless communications. Then, we delivered a proposal of Chinese millimeter wave wireless communications, named Q-LINKPAN (Q-Band, applied both for LINK and PAN) in 2009, and a research group SG5 under CWPAN was setup in 2010 to study the Q-LINKPAN standard. A research group IEEE 802.11cmmw (Chinese Millimeter Wave) was setup recently to promote the Chinese millimeter wave wireless communication standard. In this talk, we’ll give a review of the background of Q-LINKPAN and research advances in standardization, chip design and demo system in the State Key Laboratory of Millimeter Waves (SKLMMW), Southeast University.

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New renewable energy technologies, combined with a broad suite of energy-efficiency advances, are spreading widely all over the world to reduce greenhouse gas emissions and to relieve energy crisis caused by exhaustion of fossil fuels. With the development trend of energy, it is expected that distributed energy resources (DER) including distributed generation (DG), energy storage and demand response (DR) will be increasingly introduced into electric power systems in the near future. As a radically different way to deliver electricity, DER technologies are expected to make fundamental changes to the current power system structure.

One of the most difficult challenges that DER interconnection is facing is to provide state-of-the-art techniques for DER control and protection. This talk will highlight my research effort on anti-islanding protection for grid-connected DG systems, which provides a better understanding of how to design optimal islanding detection method. In the first part, I will present the investigation results of the positive feedback anti-islanding scheme for inverter-based DG. Then a systematic application guideline for the studied anti-islanding scheme will be introduced, and the analytical analysis and comparative case studies will be provided to show the effectiveness of the designed guideline. At the end of the seminar, I will share my vision of the future innovation and applications of energy technologies in renewable energy and smart grid fields.

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Semiconductor technologies exhibited explosive growth in complexity and speed over the last two decades. Since the early 1980s, the device sizes have scaled down from few micrometers to tens of Nano-meters and the operating frequencies have increased from a few megahertz to several gigahertz. Also, the spacing between devices and interconnect have dramatically decreased due to the continuous scaling down of the technology feature size. These trends have led to issues and challenges in the design and analysis of high performance integrated circuits that previous generations did not exhibit. Most of these issues are at the circuit and interconnect (physical) levels. Also, these issues are expected only to increase in importance in future generations of integrated circuits. This talk will overview the most important challenges for electronics design in the nano-scale.

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Sacling as we know it is taking a different direction from the last three decades. Chips with tens of billions of transistors and hundreds of cores are expected to be the future of scaling. These chips will achieve performance through parallelism and application specific optimized cores. This trend will use superior technologies to integrate more cores on a chip rather than to push the frequency envelope as in the past. It is expected that every aspect of design and analysis will need to be modified to accommodate this new platform and trend. There is a clear need for new CAD tools and design methodologies that are very different from existing tools in both their focus and scope. This talk will delve into the specific challenges with respect to both design and CAD that is required for these many core chips. The talk will also provide an overview into the market and technology factors guiding and driving this trend. Attendees will be provided with insight into both present and future research vectors to support this nascent exponential.

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Energy is one of the top priorities in the world and smart grids are the centerpiece of this energy focus. Grid design, control and stability are the main objectives of smart grid technology in order to enhance the voltage stability of electric power distribution systems during faulty conditions and disturbances. Analysis and benefits of implementing smart grids based on multi-agent systems (MAS) show that it is a suitable technology for the complex and highly dynamic operation of a power system network. The existing power grid suffers from the lack of pervasive and effective communications, monitoring, fault diagnostics, and automation control, which further increase the possibility of a region-wide system breakdown due to the cascading effect that can be initiated by a single fault. Currently, for the power system, voltage control systems are centralized and operated through a central computer which supervises the output of all generators and adjusts optimally the voltage set points of these generators. This centralized regulation algorithm must know the whole network configuration and therefore for a large-scale power system, it may become difficult to perform a centralized control system. This motivates us to study and find efficient and secure voltage control mechanism in a power system by identifying the most appropriate controls based on decentralized and distributed control. This presentation firstly presents a definition and vision of the smart grid and its key areas including: Sensing and Measurement, Advanced Control Methods, Advanced Components and Integrated Communications. Secondly, an optimal electrical network graph partitioning technique is presented that divides a power network into appropriate regions to eventually prevent the propagation of disturbances and minimize the interaction between these regions. The optimized number of partitions is found based on the bus voltage sensitivity to the disturbances being applied to the loads in each region. A number of representative buses which are labeled as pilot buses are established and these are identified in each region displaying the critical point for secondary voltage control. The graph theory applied to this situation has the ability to simplify and decompose large connected power networks.